Epoxy resin board use characteristics

1. Rupa-rupa wangun

Rupa-rupa résin, agén curing, sarta sistem modifier ampir bisa adaptasi jeung sarat tina rupa-rupa aplikasi dina formulir, sarta rentang bisa jadi ti viskositas pisan low ka padet titik lebur tinggi.

2. adhesion kuat

Gugus hidroksil polar alamiah sareng beungkeut éter dina ranté molekular résin époksi ngajantenkeun napel pisan kana sagala rupa zat. The shrinkage of résin epoxy low nalika curing, sarta stress internal dihasilkeun leutik, nu ogé mantuan pikeun ngaronjatkeun kakuatan adhesion.

3. Curing merenah

Milih rupa-rupa agén curing béda, sistem résin epoxy ampir bisa diubaran dina rentang hawa 0 ~ 180 ℃.

4. Lemes nyusutan

The reaction between the epoxy resin and the curing agent used is carried out by direct addition reaction or ring-opening polymerization reaction of epoxy groups in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resins and phenolic resins, they show very low shrinkage (less than 2%) during curing.

5. Sipat mékanis

Sistim résin epoxy kapok boga sipat mékanis alus teuing.

6. kinerja listrik

Sistem résin epoksi anu diubaran mangrupikeun bahan insulasi anu saé kalayan sipat diéléktrik anu luhur, résistansi bocor permukaan, sareng résistansi busur.