Inkqubo yokuveliswa kwebhodi ye-epoxy yeglasi yefiber ephezulu

A. Ukulungiswa komphezulu kunye nonyango lwe epoxy iglasi ilaphu iimveliso laminate

1. Emva kokuba indawo yobhedu yenziwe ipateni kwaye ifakwe ukwenza isiphaluka, zama ukunciphisa unyango kunye noqhagamshelwano kwi-PTFE. Umsebenzisi kufuneka anxibe iiglavu ezicocekileyo kwaye abeke ifilimu ye-interlayer kwibhodi nganye ukuze adlulele kwinkqubo elandelayo.

2. Umphezulu ochongiweyo we-PTFE unoburhabaxa obaneleyo bokudibanisa. Apho amaphepha aqoshiwe okanye i-laminates engagqunywanga iya kudityaniswa, kuyacetyiswa ukuba uphathe umphezulu we-PTFE ukubonelela ngokuqhotyoshelweyo okwaneleyo. Amacandelo amachiza asetyenziswe kwinkqubo yokulungiselela i-pth nayo ingasetyenziselwa unyango olungaphezulu. Ncoma i-plasma etching okanye i-sodium-containing chemical reagents, njenge-FluroEtch®byActon, i-TetraEtch®byGore, kunye ne-Bond-Prep®byAPC. Itekhnoloji yokucubungula ethile inikezelwa ngumthengisi.

3. Unyango lomphezulu wobhedu kufuneka luqinisekise amandla angcono okudibanisa. Unyango lwesekethe yemonoxide yobhedu olumdaka luya komeleza ubume bomphezulu ukwenza lula ukuhlangana kweekhemikhali kunye nokuncamathelisa kweTacBond. Inkqubo yokuqala idinga isicoci sokususa intsalela kunye neoli yonyango. Emva koko, kwenziwa umzobo ocolekileyo wobhedu ukwenza indawo erhabaxa efanayo. Iikristale zeenaliti ezinomdaka omdaka zizinzisa umaleko wokubopha ngexesha lenkqubo yokulambisa. Njengayo nayiphi na inkqubo yeekhemikhali, ukucocwa okwaneleyo emva kwesinyathelo ngasinye senkqubo kuyimfuneko. Intsalela yetyuwa iya kuthintela ukunamathela. Ukugungxulwa kokugqibela kufuneka kubekwe esweni kwaye ixabiso le-pH kufuneka ligcinwe lingaphantsi kwe-8.5. Uluhlu olomileyo ngoluhlu kwaye uqinisekise ukuba umphezulu awungcoliswanga ngeoli ezandleni.

B. Ukwaleka kunye ne-lamination

Ubushushu obucetyiswayo (ucinezela okanye ucofa): 425°F (220°C)

Ukubhaka iiplies kwi-1.250oF (100 ° C) ukuphelisa umswakama. Iileya zigcinwa kwindawo elawulwa ngokuqinileyo kwaye zisetyenziswe kwiiyure ezingama-24.

2. Intsimi yoxinzelelo kufuneka isetyenziswe phakathi kwebhodi yesixhobo kunye nebhodi yokuqala ye-electrolytic ukwenzela ukuba uxinzelelo kwibhodi yokulawula luhanjiswe ngokulinganayo. Iindawo zombane eziphezulu ezikhoyo ebhodini nakwibhodi yesekethe eziza kuzaliswa ziya kutsalwa yintsimi. Intsimi inokudibanisa ubushushu ukusuka ngaphandle ukuya kwiziko. Ngaloo ndlela, ubukhulu phakathi kwebhodi yokulawula kunye nebhodi yokulawula ihlangene.

3. Ibhodi kufuneka yenziwe ngomaleko obhityileyo we-TACBOND obonelelwa ngumthengisi. Qaphela ukukhusela ungcoliseko xa usika iileya ezincinci kunye nokupakisha. Ngokutsho koyilo lwesiphaluka kunye neemfuno zokuzaliswa, i-1 ukuya kwi-3 i-adhesive layers iyimfuneko. Ummandla oza kuzaliswa kunye neemfuno ze-dielectric zisetyenziselwa ukubala i-0.0015 “(38 micron) iimfuno zephepha. Kunconywa ukusebenzisa intsimbi ecocekileyo okanye iiplati zesibuko se-aluminium phakathi kwe-laminates.

4. Ukuncedisa kwi-lamination, unyango lwe-vacuum lwenziwa imizuzu engama-20 ngaphambi kokufudumeza. Ivacuum igcinwa kuwo wonke umjikelo. Ukukhupha umoya kuya kunceda ukuqinisekisa ukuba isiphaluka sipakishwe.

5. Beka i-thermocouple kwindawo ejikelezayo yeplate yeziko ukumisela esweni lobushushu kunye nomjikelo ofanelekileyo.

6. Ipleyiti inokulayishwa kwindawo ebandayo okanye i-preheated press platen ukuqala. Ukuba intsimi yoxinzelelo ayisetyenziselwa imbuyekezo, ukunyuka kobushushu kunye nokujikeleza kuya kuhluka. Igalelo lokushisa kwipakethe alibalulekanga, kodwa kufuneka ilawulwe ngokusemandleni ukunciphisa i-gap phakathi kwendawo yangaphandle kunye nephakathi. Ngokuqhelekileyo, izinga lokushisa liphakathi kwe-12-20oF / min (6-9 ° C / min) ukuya kwi-425oF (220 ° C).

7. Emva kokuba ilayishwe kumshicileli, uxinzelelo lunokusetyenziswa ngokukhawuleza. Uxinzelelo luya kwahluka kunye nobukhulu bepaneli yokulawula. Kufuneka ilawulwe ngaphakathi koluhlu lwe-100-200psi (7-14bar).

8. Gcina iqondo lokushisa elitshisayo kwi-425oF (230 ° C) ubuncinane imizuzu eyi-15. Ubushushu akufunekanga budlule kwi-450oF (235°C).

9. Ngethuba lenkqubo ye-lamination, ukunciphisa ixesha lokungabikho kwengcinezelo (njengexesha lokutshintshela kwi-hot press ukuya kwi-cold press). Gcina imeko yoxinzelelo de uxinzelelo lungaphantsi kwe-200oF (100 ° C).