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Production process of high-quality epoxy glass fiber board

Production process of high-quality epoxy glass fiber board

A. Surface preparation and treatment of epoxy glass cloth laminate products

1. After the copper surface is patterned and etched to form a circuit, try to reduce the treatment and contact on the PTFE surface. The operator should wear clean gloves and put interlayer film on each board to pass to the next procedure.

2. The etched PTFE surface has enough roughness for bonding. Where etched sheets or uncovered laminates will be bonded, it is recommended to treat the PTFE surface to provide adequate attachment. The chemical components used in the pth preparation process can also be used for surface treatment. Recommend plasma etching or sodium-containing chemical reagents, such as FluroEtch®byActon, TetraEtch®byGore, and Bond-Prep®byAPC. The specific processing technology is provided by the supplier.

3. The copper surface treatment should ensure the best bonding strength. The brown copper monoxide circuit treatment will reinforce the surface shape to facilitate chemical bonding with TacBond adhesive. The first process requires a cleaner to remove residue and treatment oil. Next, a fine copper etching is performed to form a uniform rough surface area. The brown oxide needle crystals stabilize the bonding layer during the lamination process. As with any chemical process, adequate cleaning after each step of the process is necessary. Salt residue will inhibit adhesion. The final flushing should be monitored and the pH value should be kept below 8.5. Dry layer by layer and ensure that the surface is not contaminated by oil on the hands.

B. Overlay and lamination

Recommended bonding (pressing or pressing) temperature: 425°F (220°C)

Baking the plies at 1.250oF (100°C) to eliminate moisture. The layers are stored in a tightly controlled environment and used within 24 hours.

2. A pressure field should be used between the tool board and the first electrolytic board so that the pressure in the control board can be evenly distributed. The high voltage areas present in the board and in the circuit board to be filled will be absorbed by the field. The field can also unify the temperature from the outside to the center. Thus, the thickness between the control board and the control board is unified.

3. The board must be composed of a thin layer of TACBOND provided by the supplier. Be careful to prevent contamination when cutting thin layers and stacking. According to the circuit design and filling requirements, 1 to 3 thin adhesive layers are necessary. The area to be filled and the dielectric requirements are used to calculate the 0.0015″ (38 micron) sheet requirements. It is recommended to use clean steel or aluminum mirror plates between the laminates.

4. To assist in lamination, vacuum treatment is performed for 20 minutes before heating. The vacuum is maintained throughout the cycle. Extracting the air will help ensure that the circuit is packaged.

5. Place a thermocouple in the peripheral area of ​​the center plate to determine the temperature monitoring and appropriate cycle.

6. The plate can be loaded on the cold or preheated press platen to start. If the pressure field is not used for compensation, the heat rise and circulation will be different. The heat input to the package is not critical, but it should be controlled as much as possible to reduce the gap between the outer and central areas. Generally, the heat rate is between 12-20oF/min (6-9°C/min) to 425oF (220°C).

7. Once loaded into the press, the pressure can be applied immediately. The pressure will also vary with the size of the control panel. Should be controlled within the range of 100-200psi (7-14bar).

8. Keep the hot pressing temperature at 425oF (230°C) for at least 15 minutes. The temperature must not exceed 450oF (235°C).

9. During the lamination process, minimize the time of no pressure state (such as the time to transfer from a hot press to a cold press). Maintain the pressure state until the pressure is below 200oF (100°C).